Automated processes
Overlay vision alignment system (VAS) with fixed
beam splitter
Integrated Process Management (IPM)
Real time process observation camera
Advanced system software with adaptive process
library
Process transfer from system to system
Process flexibility due to modular concept

[주요 사양]
Placement accuracy: 5 µm
Field of view (min)1
: 1.6 mm x 1.2 mm
Field of view (max)1
: 20 mm x 15 mm
Component size (min)1
: 0.125 mm x 0.125 mm
Component size (max)1
: 40 mm x 40 mm
Theta fine travel2
: ± 6°
Z- travel2 10 mm
Working area1
: 280 mm x 117 mm
Heating temp. (max)1,2*: 400 °C
Bonding force (max)1,2*: 700 N

[주요 기능]
Flip chip bonding (face down)
Precise die bonding (face up)
Laser diode, laser diode bar bonding
Optical engines, VCSEL/ photo diode bonding
LED bonding
Micro optics assembly
MEMS/ MOEMS/ sensor packaging
3D packaging
Wafer level packaging (W2W, C2W)
Chip on glass, chip on flex